\documentclass[a4paper, oneside, 10pt]{article}
\usepackage[unicode]{hyperref}
\usepackage[utf8x]{inputenc}
\usepackage[english]{babel}
\date{\today}
\title{}
\author{}
\usepackage[utf8x]{inputenc}
\begin{document}



\subsubsection{\texorpdfstring{Linker-free directed assembly of high-performance integrated devices}{Linkerfree directed assembly of highperformance integrated devices}}
\label{sec:linkerfree_directed_assembly_of_highperformance_integrated_devices}


dvanced electronic devices based on carbon nanotubes (NTs) and various
types of nanowires (NWs) could have a role in next generation
semiconductor architectures. However, the lack of a general
fabrication method has held back the development of these devices for
practical applications. Here we report an assembly strategy for
devices based on NTs and NWs. Inert surface molecular patterns were
used to direct the adsorption and alignment of NTs and NWs on bare
surfaces to form device structures without the use of linker
molecules. Substrate bias further enhanced the amount of NT and NW
adsorption. Significantly, as all the processing steps can be
performed with conventional microfabrication facilities, our method is
readily accessible to the present semiconductor industry. We use this
method to demonstrate large-scale assembly of NT- and NW-based
integrated devices and their applications. We also provide extensive
analysis regarding the reliability of the method.

\end{document}
